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bonding
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bond0
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Ethernet Channel Bonding Driver: v3.7.1 (April 27, 2011) Bonding Mode: IEEE 802.3ad Dynamic link aggregation Transmit Hash Policy: layer2+3 (2) MII Status: up MII Polling Interval (ms): 100 Up Delay (ms): 0 Down Delay (ms): 0 Peer Notification Delay (ms): 0 802.3ad info LACP active: on LACP rate: fast Min links: 0 Aggregator selection policy (ad_select): stable Slave Interface: eth0 MII Status: up Speed: 1000 Mbps Duplex: full Link Failure Count: 1 Permanent HW addr: 00:25:90:c2:ca:dc Slave queue ID: 0 Aggregator ID: 1 Actor Churn State: none Partner Churn State: none Actor Churned Count: 0 Partner Churned Count: 0 Slave Interface: eth1 MII Status: up Speed: 1000 Mbps Duplex: full Link Failure Count: 0 Permanent HW addr: 00:25:90:c2:ca:dd Slave queue ID: 0 Aggregator ID: 1 Actor Churn State: none Partner Churn State: none Actor Churned Count: 0 Partner Churned Count: 0